Holography Unlocks Potential for Nanostructures Within Silicon

Researchers at Bilkent University in Turkey have advanced the field of nanotechnology through the application of holographic techniques to fabricate nanostructures deep inside silicon wafers.

This new approach could improve the design of next generation electronic, photonic, and optical devices.

Breaking with tradition

Traditionally, nanofabrication within silicon has been restricted to its surface, limiting the complexity and variety of structures that could be achieved.

By delving into the bulk of the wafer, the researchers at Bilkent University, led by Prof Onur Tokel, have opened the door to deeper, more complex architectures, achieving feature sizes down to 100 nanometres (nm) within the wafer’s interior. This work lays the foundation for creating complete 3D nanostructures inside silicon ¹.

To make this possible, the team applied laser pulses to modify the silicon at a nanoscale level, creating intricate features without disturbing the wafer’s surface. This method could enable the integration of nanophotonic elements and 3D structures within silicon.